Plasma etching
Oxford PlasmaPro100 Cobra (Cobra)
A reactive ion etch system with inductively-coupled plasma. It has a combined load lock system via cleanroom interface for the RIE/ICP etch Cobra and the ICPCVD system
- gas inlet system for pressure control and gas mixtures
- gasses; CHF3, SF6, O2, Ar, C4F8, CF4, HBr and Cl2
- 300W RIE RF generator
- 3 kW ICP RF generator
- laser interferometer end point detector
- chiller temperature range 0°C to +80°C
- LN cryo-cooled electrically-heated temperature range -100°C to +400°C
- 4” wafer clamping with helium assisted heat transfer
- vacuum system; 1400 l/s turbo pump with a dry prevacuum pump
- scrubber for toxic gases
- It has a twin system, nicknamed the Viper
AMOLF NanoLab Amsterdam
AMOLF NanoLab Amsterdam is a facility for materials fabrication and characterization down to the nanometer scale. It aims to provide state-of-the art opportunities in nano research, servicing the scientific and engineering community within the greater Amsterdam area.
