Oxford PlasmaPro 100 Cobra (Viper)

A reactive ion etch system with inductively-coupled plasma, with deep RIE options available such as Bosch and cryogenic etching.

• Gas inlet system for pressure control and gas mixtures
• Available gasses; CHF3, SF6, O2, Ar, C4F8, CF4, HBr and Cl2
• 300W RIE RF generator (including attenuator to go down to single Watt power output)
• 3 kW ICP RF generator
• Laser interferometer end point detection
• Chiller temperature range 0°C to +70°C
• LN cryo-cooled electrically-heated temperature range -100°C to +400°C
• 4” wafer clamping with helium assisted heat transfer
• Vacuum system; 1400 l/s turbo pump with a dry pre-vacuum pump
• Scrubber for toxic gases
• Close coupled gas pod for fast gas switching
• It has a twin system, nicknamed the Cobra